Wafers
Acura Materials Corp., AET Advanced EPI Technology, Cemat Silicon, Chartered Semiconductor Manufacturing, Crystal Dynamics, Inc., Crystal Technology, Inc., Fujitsu Ltd., Global Communication Semiconductors, Inc., Global Communication Technology Corp., Grinding and Dicing Services, Inc.
1st Silicon
Semiconductor foundry founded in 1998 by the Malaysian State of Sarawak. 0.18 and 0.25 micron CMOS and mixed signal CMOS IC.
Advanced Thin Film Technologies
Supplying custom coatings and patterned substrates to customers involved with microelectronics with information on coatings, patterning, capabilities, manufacturing and contacts.
Advanced Thin Film Technology
Provides high quality thin film coatings, patterned substrates, hybrid and resistor networks.
Aliasic
An RF IC design service offering solutions for analog RF and mixed-signal projects from draft to production.
Allied Coatings
Custom thin film deposition and thin film device fabrication.
AME AS
Custom and standard silicon photodetectors and thick and thin film optoelectronic devices, offering wafer fabrication, bonding and packaging, and testing.
Amitec
Provides high density interconnect (HDI) substrates and flip chip semiconductor BGA packaging for single or multichip (MCM) modules. Packaging description, technical notes, and company presentations.
Ampac Enterprises, Inc.
Offering assembly services for plastic IC packaging and full box build contract manufacturing.
Artest
Engineering, production test and backend manufacturing management services for semiconductor manufacturers and designers.
ASE Korea, Inc.
Assembly and testing services for sensor, wireless, and automotive semiconductors. Facilities in Asia, Europe, and USA. Site lists capabilities including test equipment used, and package datasheets are available in PDF.
Catalyst Microtech LLC
Semiconductor assembly and packaging services, including quick turn and turn key projects for mil-std, BGA, folded flex, and multichip packages. List of services and factory equipment and quotation form.
Chartered Semiconductor Manufacturing
Dedicated integrated circuit (IC) wafer foundry
Cirtek Electronics Corporation
An independent subcontractor for semiconductor assembly, test and packaging services.
DALSA Semiconductor
Open foundry offering specialty wafer fabrication for MEMS, high voltage CMOS, analog and mixed signal CMOS, and CCDs with experience in telecom, telephony, and optical networking chips. Company overview, facilities and manufacturing process descriptions.
Dolphin Technology Inc.
Provides a wide range of high performance, high speed silicon-IP. For designers, needing standard or custom IP such as memory, I/O, standard cell libraries, data path modules or analog blocks.
Eltek Semiconductors Ltd
Procuring and processing semiconductor components in wafer, die and packaged form.
First Level Inc.
Manufacturing service specializing in microelectronic packaging needs. Offering contract assembly in ESD protected clean rooms, COB, die attach, wirebonding, component pick and place, MCM, BGA, CSP, and flip chip.
Honeywell Electronic Materials
Offers interconnect solutions and IC packaging specializing in on-chip semiconductor interconnects, including spin-on dielectrics and sputtering targets. Site includes product and technology briefs, and a description of company's manufacturing cleanroom.
HTE Labs
Provides wafer foundry, R&D support and specialty wafer fab processing to customers from semiconductors and microelectronic industry; active and passive components, and opto devices. Semconix Corporation.
Incide
A fabless design house focused on RF and high-speed digital integrated designs.
Jade Precision Engineering Pte Ltd
Singapore-based company providing lead-frame stamping, milling, plating, and taping services for semiconductors. Company history, description of services, and photos of example products.
M-SQUARE Technologies Corp.
An ic-design house for consumer, caller id, and related telecom products.
MEMT Co.
A 6" discrete wafer foundry, specializing in Schottky, SF, TVS and Thyristor wafer.
NILY technologies
Fabless company aiming to lead the RF GaAs and silicon IC intellectual properties. Leveraging advanced design capabilities, simulation, layout tools to shorten specific RF circuit and system needs.
NOVASIC
Providing wafering and polishing services of high performance semiconductors and industrial crystals.
NS Electronics
IC packaging and test turnkey solutions with excellent quality, cycle time and pricing.
PolarFab
Bipolar and BiCMOS wafer manufacturing processes. Bloomington, MN, USA.
Premier Semiconductor Services
Back-end services for commercial, aerospace, and military products including semiconductor taping, BGA balling, and baking.
Prologue Technology Inc.
Manufacturer representative for semiconductor design and manufacturing. Based in Markham, Ontario, Canada, serving primarily Canada, Central and Eastern US. Close proximity to the Lester B. Pearson Airport in Toronto.
Promex Industries Inc.
Microelectronics technologies, specialty chip packaging, design, layout, materials expertise, process engineering for outsourced optoelectronics, microelectronics, chip packaging and manufacturing. From China.
Protochips Inc.
Offers custom layout and fabrication services for emerging companies and university groups.
Reltech Limited
European supplier of advanced semiconductor burn-in and reliability test systems.
ReShape, Inc.
A contract design source for IC layout utilizing automated design.
Satcon Electronics
Manufacturer standard and custom microelectronic assemblies, thin film substrates, semiconductor packaging and wire bonding. Company overview and list of capabilities.
Sigurd Microelectronics Corporation
Provides semiconductor IC assembly and testing services.
Silicon Infusion Limited
Provides single chip solutions for T1/E1/J1, DTMF, ADPCM, and many other telecommunications standards.
Silterra Malaysia Sdn Bhd
Manufacturer of semiconductors and wafers. Headquarters in Kulim, Kedah, Malaysia.
Stats
Semiconductor test and assembly provider servicing wafer foundries, integrated device manufacturers and fabless semiconductor companies worldwide.
Tower Semiconductor LTD.
Independent foundry of semiconductor integrated circuits specializing in embedded nonvolatile memory, CMOS image sensors, and mixed signal devices. 0.35 micron and up. Israel.
Trikon Technologies
Semiconductor manufacturer utilizing plasma etch, PVD (physical vapour deposition) and CVD (chemical vapour deposition) equipment.
Valtronic
Manufacturers custom miniature modules and packaging, including chip-on-board, flip chip, chip-on-chip, and multichip modules. Site include capabilites, and illustrated discussions of packaging technologies and processes.
ViASIC
Company offering low NRE one mask architecture and software solutions to the ASIC community. Aimed at FPGA conversion and ASIC replacement markets.
WaferTech
Wafer manufacturing, probing, assembly and final test. .25 micron. Fab in Washington State, USA.
Walls Technology Co.
Custom RF and microwave (wireless) product development. Requirements definition, analysis, design, prototype build and test.